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Why EMI Matters to Automotive Electronics

Director of Automotive Business Development Peter Vaughan discusses how Power Integrations products properly tested for EMI can reduce the risk and time associated with the development of automobiles.

HiperLCS-2 Chipset Introduction

The new HiperLCS-2 chipset (HiperLCS2-HB power device + HiperLCS2-SR isolation device) brings Power Integrations’ unique 600 V FREDFETs and magneto-inductive FluxLink technology to the LLC topology. The result is 98%...

HiperPFS-5 Product Introduction

The HiperPFS-5 high-efficiency quasi-resonant PFC ICs with 750 V PowiGaN switch enable compact power-factor stage for ultra-fast chargers, consumer electronics, computer and appliance power supplies. Vice President of Marketing Doug...

Balu Explains Advantages of InnoSwitch3-TN

Highly integrated InnoSwitch3-TN flyback switcher ICs are ideal for smart-connected appliances that require high efficiency during light load and low component count, which are increasingly difficult to realize with traditional...

SCALE EV Gate-Driver Boards - Product Introduction
The SCALE EV family of gate-driver boards for Infineon™ EconoDUAL™ modules featuring reinforced isolation are suitable for original, clone and new SiC variants. The new product targets high-power automotive and...
Eliminating 12 V Lead-Acid Batteries in EVs

Director of Automotive Business Development Peter Vaughan introduces RDR-919Q, a 60 W power supply design for 800 V bus using SiC-based InnoSwitch3-AQ switcher ICs that eliminates the need for a...